5-5353648-9 datasheet

Маркировка

5-5353648-9
Производитель

TE Connectivity
Описание

TE Connectivity 5-5353648-9 Board-to-board Stack Height (mm [in]): 4.00 [0.157], 7.00 [0.276], 8.00 [0.315] Centerline (mm [in]): 0.50 [0.0197] Connector Style: Receptacle Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (8) Family Name: Free Height Grounding Contact: With Grounding Plate: Without Industry Application: Board-to-Board (Personal Systems/Computers), MFP/LBP, Inkjet Keyed: Yes Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Locating Post(s): With Number Of Positions: 120 Packaging Method: Tape & Reel Pcb Mounting Orientation: Vertical Region: Asia/Pacific Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Sealant: With Type: COM Express Vacuum Cover: With
Количество страниц

5 шт.
Формат

PDF
(Для просмотра требуется Adobe Acrobat Reader)
Размер файла

724,22 KB